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Halogen free Fr4 Lead Free PCB High Precision Fabrication Customized with immersion gold

Halogen free Fr4 Lead Free PCB High Precision Fabrication Customized with immersion gold

Halogen free Fr4 Lead Free PCB High Precision Fabrication Customized with immersion gold
Halogen free Fr4 Lead Free PCB High Precision Fabrication Customized with immersion gold
Halogen free Fr4 Lead Free PCB High Precision Fabrication Customized with immersion gold
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P1205
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 10days
Payment Terms: L/C / D/P / T/T / Western Union / Paypal
Supply Ability: 30,000SQ.M/Month
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Detailed Product Description
Material: ITEQFR4 Thickness: 1.60mm
Surface Finish: HAL Lead Fee Application: Test Equipment
Size: 280mmX100mm Color: Green Solder Mask
High Light:

monitor circuit board

,

halogen free pcb

Halogen free Fr4 Lead Free PCB High Precision Fabrication Customized with immersion gold

 

Production description :

this board is 4layer PCB it is used on test equipment. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new boards.

 

Production Feature:

Layer: 4Layers
Base Material: ITEQ FR4
Copper Thickness: 1/1/1/1oz
Board Thickness: 1.60mm
Min. Hole Size: 8mil, 0.2mm
Min. Line Width:4/4 mil 0.0762/0.0762 mm
Min. Line Spacing: 4/4mil, 0.0762/0.0762mm
Surface Finish: Immersion gold
Application: test equipment
Certification: ISO9001, UL, ROHS,TS16949

 

Quality assurance :

Every production process has a special person to test to ensure quality

Have professional engineers to check the quality

All products have passed CE, FCC, ROHS and other certifications

 

Advantages :
▪ No MOQ, 14 years of PCB turnkey services
▪ Quick turn, prototype, low & medium & high volume
▪ OEM services provide
▪ ISO 9001-, ISO 14001-, ISO/TS16949, ISO 13485, IATF16949, OHSAS18001 certified
▪ 100% E-test, visual, AOI inspection, including X-ray, 3D microscope
▪ Fast response within 24 hours

 

Technology Capability:

Item Technical Parameters
Layers 1-28 Layers
Inner Layer Min Trace/Space 4/4 mil
Out Layer Min Trace,Space 4/4 mil
Inner Layer Max Copper 4 OZ
Out Layer Max Copper 4 OZ
Inner Layer Min Copper 1/3 oz
Out Layer Min Copper 1/3 oz
Min hole size 0.15 mm
Max.board thickness 6 mm
Min.board thickness 0.2mm
Max.board size 680*1200 mm
PTH Tolerance +/-0.075mm
NPTH Tolerance +/-0.05mm
Countersink Tolerance +/-0.15mm
Board Thickness Tolerance +/-10%
Min BGA 7mil
Min SMT 7*10 mil
Solder mask bridge 4 mil
Solder mask color White,black,blue,green,yellow,red,etc
Legend color White,black,yellow,gray,etc
Surface finish HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG
Board materials FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB
Impedance control +/-10%
Bow and twist ≤0.5

 

FAQ :

1. How do ACCPCB ensure quality?

   Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

   Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

    PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

   Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

    the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


6. What are the main factors which will affect the price of PCB?

   Material;
   Surface finish;

   Board thickness, Copper thickness;
   Technology difficulty;
   Different quality criteria;
   PCB characteristics;
   Payment terms;

 

7. How to you make the impedance calculation?

   The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

 

                      Halogen free Fr4 Lead Free PCB High Precision Fabrication Customized with immersion gold 0

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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