12 Layer ITEQ FR4 TG170 Rigid High Density Pcb Fabrication Service

12 Layer ITEQ FR4 TG170 Rigid High Density Pcb Fabrication Service

Production description :

this board is 12layer PCB . we can accept  PCB prototype,samll volum, middle and large volume. no MOQ request for new boards. All PCB are passed UL, TS16949, ROHS ,ISO9001 etc. Certification.

Key Specifications/Special Features:
Layer : 12Layers
Base Material :  ITEQFR4 TG170
Copper Thickness : 1oz inner layer /  1.5oz outlayer
Board Thickness :   1.0mm
Surface copper thickness : Maximum: 6/6oz / Minimum: 0.5/0.5oz

Maximum board thickness : 6.0mm
Minimum track space : 4/4, 3mil partial allowed
Minimum size : 3 x 3mm
Maximum size : 1000 x 1200mm

Technology Capability:

Products Application:

1, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

2, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

3, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

4, Vehicle Electronices: Car etc;

5, Industrial controls: Medical device ,UPS equipment, Control device etc;

6, Military & Defense : Military Weapons etc;
 
Lead Time:

Advantages :
•  Strict product liability, taking IPC-A-160 standard
•  Engineering pretreatment before production
•  Production process control (5Ms)
•  100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
•  100% AOI inspection, including X-ray, 3D microscope and ICT
•  High-voltage test, impedance control test
•  Micro section, soldering capacity, thermal stress test, shocking test
•  In-house PCB production
•  No minimum order quantity and free sample
•  Focus on low to medium volume production
•  Quick and on-time delivery 
 

FAQ:

1. What kinds of boards can ACCPCB process?

   Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
2. What data are needed for PCB production?

   PCB Gerber files with RS-274-X format.
3. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
5. How many types of surface finish ACCPCB can do?

   the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

6. How do ACCPCB ensure quality?

  Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process